IDiyas

For the Inventor, By the Inventor

Hwaseong-si, South Korea

Seong-Ho Shin

USPTO Granted Patents = 9 

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 61(Granted Patents)


Location History:

  • Hwasung-si, KR (2014 - 2015)
  • Hwaseong-si, KR (2014 - 2017)

Company Filing History:

goldMedal9 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2014-2017

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9 patents (USPTO):Explore Patents
1. 9627126 - Printed circuit board including inductor (2017-04-18),
2. 9570383 - Semiconductor package, module substrate and semiconductor package module having the same (2017-02-14),
3. 9520387 - Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer (2016-12-13),
4. 9142478 - Semiconductor package stack having a heat slug (2015-09-22),
5. 8981581 - Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements (2015-03-17),
6. 8921993 - Semiconductor package having EMI shielding function and heat dissipation function (2014-12-30),
7. 8884446 - Semiconductor packages (2014-11-11),
8. 8872319 - Stacked package structure including insulating layer between two stacked packages (2014-10-28),
9. 8680667 - Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements (2014-03-25),

Title: The Innovative Mind of Seong-Ho Shin

Introduction: Seong-Ho Shin is an accomplished inventor based in Hwaseong-si, South Korea, with an impressive portfolio of nine patents. His work primarily focuses on advancements in electronic components and semiconductor technologies, where he consistently pushes the boundaries of innovation.

Latest Patents: Among his latest patents, one notable invention is a printed circuit board (PCB) that integrates an inductor. The design includes an insulating substrate, several copper foil pattern layers, and insulating adhesive sheets, which are strategically stacked. This PCB features an inductor within the upper copper foil layer, a grounding element in the lower layer, and a single through hole that connects the two, enhancing connectivity in electronic designs. Another significant patent concerns semiconductor packages, module substrates, and corresponding semiconductor package modules. This innovation describes a module substrate that hosts numerous signal wires and external connection terminals, complemented by a package substrate and semiconductor chip arrangement. These inventions showcase his dedication to improving efficiency and functionality in electronic systems.

Career Highlights: Seong-Ho Shin's career has been marked by his contributions to Samsung Electronics Co., Ltd., a leading technology company. His work at Samsung has allowed him to apply his inventive ideas in practical applications, influencing advancements in consumer electronics and beyond. His nine patents reflect his commitment to enhancing technology through creative solutions.

Collaborations: Throughout his career, Seong-Ho Shin has collaborated with talented colleagues such as Yong-hoon Kim and Hee-Seok Lee. These partnerships have facilitated a dynamic environment of innovation, resulting in notable inventions that help shape the future of electronics.

Conclusion: Seong-Ho Shin stands out as a significant figure in the field of electronics, demonstrating a strong passion for innovation through his patents. His contributions to Samsung Electronics and teamwork with other skilled inventors illustrate how collaboration and creativity can lead to remarkable advancements in technology. As he continues to explore new ideas, the impact of his work will undoubtedly resonate within the industry for years to come.

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