The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Apr. 17, 2014
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Hyun-Jong Moon, Seoul, KR;

Bok-Sik Myung, Seongnam-si, KR;

Seong-Ho Shin, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01F 27/28 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H05K 1/024 (2013.01); H05K 1/165 (2013.01); H01F 2027/2809 (2013.01); H05K 1/0298 (2013.01);
Abstract

A printed circuit board (PCB) includes an insulating substrate, a plurality of copper foil pattern layers and a plurality of insulating adhesive sheets sequentially stacked on an upper side of the insulating substrate and a lower side of the insulating substrate, an inductor included in the copper foil pattern layer disposed on the upper side of the insulating substrate, a grounding element included in the copper foil pattern layer disposed on the lower side of the insulating substrate, and a single through hole penetrating the insulating substrate and the insulating adhesive sheets. The single through hole is disposed between the inductor and the grounding element.


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