Seoul, South Korea

Young Kuk Park


Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 84(Granted Patents)


Company Filing History:


Years Active: 2003-2012

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6 patents (USPTO):Explore Patents

Title: Young Kuk Park: Innovator in Semiconductor Technology

Introduction

Young Kuk Park is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His innovative work has paved the way for advancements in semiconductor packaging and production methods.

Latest Patents

One of Young Kuk Park's latest patents is focused on an adhesive on wire stacked semiconductor package. This invention describes a semiconductor package and a method of producing it, which includes a substrate. A first semiconductor chip is coupled to a surface of the substrate, featuring first and second surfaces that are substantially flat. An adhesive layer is attached to the second surface of the first semiconductor chip. Additionally, a second semiconductor chip, also with flat surfaces, is provided. An insulator is coupled to the first surface of the second semiconductor chip to prevent shorting of wirebonds. The second semiconductor chip is then coupled to the adhesive layer via the insulator.

Career Highlights

Throughout his career, Young Kuk Park has worked with notable companies such as Amkor Technology, Inc. and the Korea Electronics Technology Institute. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Young Kuk Park has collaborated with several professionals in his field, including Kwang Seok Oh and Jong Wook Park. These collaborations have further enhanced his work and contributions to semiconductor advancements.

Conclusion

Young Kuk Park is a distinguished inventor whose work in semiconductor technology has led to significant innovations. His patents and collaborations reflect his commitment to advancing the field and improving semiconductor packaging methods.

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