The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
Nov. 16, 2010
Kwang Seok OH, Seoul, KR;
Jong Wook Park, Seoul, KR;
Young Kuk Park, Seoul, KR;
Byoung Youl Min, Seoul, KR;
Kwang Seok Oh, Seoul, KR;
Jong Wook Park, Seoul, KR;
Young Kuk Park, Seoul, KR;
Byoung Youl Min, Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.