This inventor holds 9 USPTO granted patents and 3 published patent applications. Top assignee: Disco Corporation. Active years: 2016-2024.
Company Filing History:
Years Active: 2016-2024
Title: Innovations by Yoshiteru Nishida
Introduction
Yoshiteru Nishida is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing, holding a total of 9 patents. His work focuses on innovative methods that enhance the efficiency and effectiveness of wafer processing techniques.
Latest Patents
One of his latest patents is a wafer processing method that includes several steps. The process begins with a resin film coating step, where a water-soluble resin is applied to the upper surface of a wafer and a dicing tape. This is followed by a partial resin film removing step, which exposes regions of the wafer for further processing. The etching step involves plasma etching to divide the wafer into individual device chips. Finally, a whole resin film removing step cleans the frame unit by removing the resin film entirely.
Another notable patent is a processing method of a wafer that has a functional layer on its front surface. This method includes a laser processing step that forms grooves while removing the functional layer. It also features a cut groove forming step, where cut grooves are created inside the laser processed grooves. The grinding step exposes the cut grooves on the back surface of the wafer, allowing for the division of the wafer into multiple device chips. Additionally, a processing distortion removal step is included, which uses a gas in a plasma state to eliminate any processing distortion.
Career Highlights
Yoshiteru Nishida is currently associated with Disco Corporation, where he continues to innovate in wafer processing technologies. His expertise and dedication to advancing this field have made him a respected figure among his peers.
Collaborations
He has collaborated with notable coworkers such as Hiroyuki Takahashi and Kenta Chito, contributing to various projects that push the boundaries of wafer processing techniques.
Conclusion
Yoshiteru Nishida's contributions to wafer processing through his innovative patents and collaborative efforts highlight his significant role in the field. His work continues to influence advancements in technology and manufacturing processes.