Company Filing History:
1 out of 1 
1 out of 57 
1 out of 6 Years Active: 2001
Title: Innovations by Yoshihisa Ogawa
Introduction
Yoshihisa Ogawa is a notable inventor based in Chiba, Japan. He has made significant contributions to the field of polishing compounds, holding a total of 3 patents. His work focuses on developing advanced methods and materials for polishing applications, particularly in the semiconductor industry.
Latest Patents
Ogawa's latest patents include a polishing compound and a method for polishing. The first patent describes a polishing compound that comprises a colloidal solution containing 1-15 wt. % of silicon oxide particles with an average diameter ranging from 8 to 500 nanometers. This colloidal solution is prepared as a buffer solution, which has buffering action between pH 8.7 and 10.6. The preparation involves the addition of a combination selected from groups composed of weak acid and strong base, strong acid and weak base, or weak acid and weak base. The logarithms of the reciprocal number of the acid dissociation constant at 25°C of the weak acid and/or weak base range from 8.0 to 12.0.
The second patent presents a polishing method for silicon wafers that utilizes a polishing compound designed to reduce stains. This invention provides a polishing compound that prevents stain growth on the surface of the workpiece. It comprises a dispersion containing 1-30 wt. % of metal oxide particles with an average diameter of 8-500 nm, along with acid or alkali and salt, maintaining a pH of 7-12. Ideally, this polishing compound contains a water-soluble organic solvent. Additionally, the invention outlines edge polishing and surface polishing methods using the described polishing compound.
Career Highlights
Throughout his career, Yoshihisa Ogawa has worked with companies such as Speedfam-pec Co Ltd and Speedfam Co Ltd. His experience in these organizations has contributed to his expertise in the development of polishing technologies.
Collaborations
Ogawa has collaborated with notable coworkers, including Hiroaki Tanaka and Akitoshi Yoshida. Their combined efforts have further advanced the innovations in polishing methods and compounds.
Conclusion
Yoshihisa Ogawa's contributions to the field of polishing compounds demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials and methods that enhance the polishing process, particularly in the semiconductor industry. His work
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