Yoong Tatt P Chin

Title: Innovations by Yoong Tatt P Chin

Introduction

Yoong Tatt P Chin is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of technology, particularly in the area of stress-relief mechanisms in electronic components. With a total of 3 patents to his name, his work has garnered attention in the industry.

Latest Patents

One of his latest patents focuses on stress-relief layers and stress-compensation collars that utilize low-temperature solders for board-level joints. This innovative approach involves forming a stress-relief layer by dispensing a polymer on a substrate's lower surface, which partially embeds a low melting-point solder bump. The stress-relief layer is designed to flow against the solder bump, enhancing the durability of electronic connections. Additionally, a stress-compensation collar is created on the board to which the substrate is mated, further embedding the solder bump. This invention also includes a computing system that integrates the low melting-point solder, stress-relief layer, and stress-compensation collar, showcasing a comprehensive solution for electronic assembly.

Career Highlights

Yoong Tatt P Chin is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has allowed him to explore and develop advanced technologies that improve the reliability of electronic devices.

Collaborations

Throughout his career, Yoong has collaborated with talented individuals such as Daewoong Suh and Saikumar Jayaraman. These collaborations have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Yoong Tatt P Chin's contributions to the field of technology, particularly through his innovative patents, highlight his role as a significant inventor in the industry. His work continues to influence the design and manufacturing of electronic components, ensuring greater reliability and performance.