The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Mar. 31, 2004
Daewoong Suh, Phoenix, AZ (US);
Saikumar Jayaraman, Chandler, AZ (US);
Mohd Erwan P. Bin Basiron, Pulau Pinang, MY;
Sheau Hooi Lim, Penang, MY;
Yoong Tatt P. Chin, Penang, MY;
Daewoong Suh, Phoenix, AZ (US);
Saikumar Jayaraman, Chandler, AZ (US);
Mohd Erwan P. Bin Basiron, Pulau Pinang, MY;
Sheau Hooi Lim, Penang, MY;
Yoong Tatt P. Chin, Penang, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a solder bump that is disposed upon the lower surface. The stress-relief layer flows against the solder bump. A stress-compensation collar is formed on a board to which the substrate is mated and the SCC partially embeds the solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes a stress-relief layer and a stress-compensation collar is also included.