This inventor holds 2 USPTO granted patents. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2006-2007.
Company Filing History:
Years Active: 2006-2007
Title: Innovations by YongGil Lee in Semiconductor Packaging
Introduction
YongGil Lee is a notable inventor based in Paju, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative processes and designs. With a total of 2 patents to his name, Lee continues to push the boundaries of technology in this critical area.
Latest Patents
YongGil Lee's latest patents focus on processes and lead frames for making leadless semiconductor packages. One of his inventions describes a method for creating multiple leadless packages. In this process, chips are attached to a lead frame with a first metal layer. After conducting wire bonding and encapsulating steps, portions of each lead are etched away to form connection pads that remain electrically connected via the first metal layer. A second metal layer is then electroplated on the connection pads and die pads, utilizing the first metal layer as an electrical path. The first metal layer is subsequently removed, followed by a singulation step to complete the process. This invention also introduces a new lead frame design.
Another patent by Lee outlines a similar process for making leadless packages. In this design, each lead of the frame consists of three portions, with the first metal layer absent on the third portion. After wire bonding and encapsulation, a second metal layer is selectively plated on the first and second portions of the leads. The third portion is then etched away to electrically isolate the first and second portions. A final singulation step concludes the process, further showcasing Lee's innovative approach to semiconductor packaging.
Career Highlights
YongGil Lee is currently employed at Advanced Semiconductor Engineering, Inc., where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the efficiency and effectiveness of semiconductor packaging processes.
Collaborations
Lee collaborates with talented colleagues such as HyungJun Park and KyungSoo Rho, contributing to a dynamic team focused on innovation in semiconductor technology.
Conclusion
YongGil Lee's contributions to semiconductor packaging through his innovative patents and collaborative efforts highlight his significant role in the industry. His work continues to influence advancements in technology, making him a key figure in the field.