Yong-Zhong Hu

Title: Innovations by Inventor Yong-Zhong Hu

Introduction

Yong-Zhong Hu is a prominent inventor based in Cupertino, California. He has made significant contributions to the field of chip packaging technology, holding a total of five patents. His work focuses on enhancing the efficiency and effectiveness of chip package units and methods.

Latest Patents

Yong-Zhong Hu's latest patents include innovative designs for chip package units and chip packaging methods. One of his patents describes a chip package unit that consists of a base material, at least one chip, a package material that encloses the base material and the chip, and a heat dissipation paste curing layer. This layer is formed by curing the heat dissipation paste on the top side of the package material or the back side of the chip in a printed pattern. Another patent outlines a chip packaging method that involves providing a wafer with multiple bumps, cutting the wafer into chip units, and disposing these units on a base material. This method ensures that the bumps on the chip units abut against the base material, enhancing thermal conductivity.

Career Highlights

Throughout his career, Yong-Zhong Hu has worked with notable companies in the semiconductor industry, including Richtek Technology Corporation and Alpha & Omega Semiconductor Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in chip packaging.

Collaborations

Yong-Zhong Hu has collaborated with talented professionals in his field, including Hao-Lin Yen and Heng-Chi Huang. These collaborations have contributed to the advancement of technology in chip packaging.

Conclusion

Yong-Zhong Hu's contributions to chip packaging technology through his patents and collaborations highlight his role as an influential inventor in the semiconductor industry. His innovative approaches continue to shape the future of chip packaging methods and units.