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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11469162 B1

PDFFull Text
Date of Patent:
Oct. 11, 2022

Filed:

Jun. 24, 2021

Plurality of vertical heat conduction elements attached to metal film

Applicant:

Richtek Technology Corporation, Zhubei, TW;

Inventors:

Hao-Lin Yen, Taoyuan, TW;

Heng-Chi Huang, Hsinchu, TW;

Yong-Zhong Hu, Cupertino, CA (US);

Assignee:

RICHTEK TECHNOLOGY CORPORATION, Zhubei, TW;

Attorney:

Tung & Associates

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/34 (2006.01); H01L 23/28 (2006.01); H01L 21/00 (2006.01); H05K 7/20 (2006.01); H01L 23/31 (2006.01); H01L 25/07 (2006.01); H01L 23/14 (2006.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/14 (2013.01); H01L 23/3107 (2013.01); H01L 23/345 (2013.01); H01L 23/4951 (2013.01); H01L 23/4952 (2013.01); H01L 23/49541 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 25/072 (2013.01); H01L 25/0753 (2013.01); H01L 2023/405 (2013.01); H01L 2924/181 (2013.01);
Abstract

The present invention provides a chip packaging method, which includes: providing a base material, which includes plural finger contacts; disposing plural chips on the base material by flip chip mounting technology, and disposing plural vertical heat conducting elements surrounding each of the chips to connect the finger contacts on the base material; providing a packaging material to encapsulate the base material, the chips, and the vertical heat conducting elements; adhering a metal film on the packaging material via an adhesive layer, to form a package structure; and cutting the package structure into plural chip package units, wherein each of the chip package units includes one of the chips, a portion of the base material, a portion of the metal film, and a portion of the vertical heat conducting elements surrounding the chip.

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