Hao-Lin Yen

Title: Hao-Lin Yen: Innovator in Chip Packaging Technology

Introduction

Hao-Lin Yen is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 3 patents. His innovative approaches have paved the way for advancements in the efficiency and effectiveness of chip packaging methods.

Latest Patents

Yen's latest patents include a chip package unit and a chip packaging method. The chip package unit features a base material, at least one chip disposed on the base material, and a package material that encloses both the base material and the chip. Additionally, it incorporates at least one heat dissipation paste curing layer, which is formed by curing the heat dissipation paste on either the top side of the package material or the back side of the chip in a printed pattern. The chip packaging method involves providing a wafer with multiple bumps, cutting the wafer into chip units, and disposing the chip units on a base material. This method ensures that the bumps on the chip units abut against the base material, enhancing the thermal management of the chip package unit.

Career Highlights

Hao-Lin Yen is currently employed at Richtek Technology Corporation, where he continues to innovate in the field of chip packaging. His work has been instrumental in developing new technologies that improve the performance and reliability of electronic devices.

Collaborations

Yen collaborates with talented coworkers, including Heng-Chi Huang and Yong-Zhong Hu, to further advance the research and development of chip packaging technologies.

Conclusion

Hao-Lin Yen's contributions to chip packaging technology demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the complexities involved in chip packaging, making him a valuable asset to Richtek Technology Corporation and the broader electronics industry.