Company Filing History:
Years Active: 2022-2025
Title: Innovations by Heng-Chi Huang
Introduction
Heng-Chi Huang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of chip packaging technology. With a total of 3 patents, his work has advanced the efficiency and effectiveness of chip packaging methods.
Latest Patents
Huang's latest patents include a chip package unit and a chip packaging method. The chip package unit comprises a base material, at least one chip disposed on the base material, a package material that encloses both the base material and the chip, and at least one heat dissipation paste curing layer. This layer is formed by curing the heat dissipation paste on either the top side of the package material or the back side of the chip in a printed pattern. The chip packaging method involves providing a wafer with multiple bumps, cutting the wafer into chip units, and disposing these units on a base material. The method ensures that the bumps on the chip units abut against the base material, enhancing thermal conductivity.
Career Highlights
Heng-Chi Huang is currently employed at Richtek Technology Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in developing advanced packaging solutions that improve the performance of electronic devices.
Collaborations
Huang collaborates with talented coworkers such as Hao-Lin Yen and Yong-Zhong Hu. Their combined expertise contributes to the success of their projects and the advancement of technology at Richtek Technology Corporation.
Conclusion
Heng-Chi Huang's contributions to chip packaging technology demonstrate his innovative spirit and commitment to advancing the field. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing.