Ying-Wei Lee

Title: Ying-Wei Lee: Innovator in Circuit Board Technology

Introduction

Ying-Wei Lee, an accomplished inventor based in Taoyuan County, Taiwan, has made significant contributions to the field of circuit board manufacturing. With a total of two patents to his name, he exemplifies dedication to innovation and technological advancement in the electronics industry.

Latest Patents

Among his latest innovations, Ying-Wei Lee has developed a patented method of manufacturing a printed circuit board precursor. This method entails several key steps, beginning with providing a substrate. The surface of the substrate is then catalyzed to form a catalytic layer using a catalyst. Following this, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated onto the conductive layer, resulting in a sophisticated printed circuit board precursor that demonstrates enhanced functionality.

Another notable patent from Ying-Wei Lee is for a flexible circuit board and the process for producing it. This invention features a substrate with a polyimide layer, which is designed to create a compartment with an inner wall surface comprising a side wall and a bottom wall. The compartment is intended for housing a multilayer unit, which consists of an adhesion enhancing layer, a first electrically conducting layer, and a second electrically conducting layer. The adhesion enhancing layer is made of palladium, while the first electrically conducting layer is composed of nickel, and the substrate is entirely made of polyimide (PI).

Career Highlights

Ying-Wei Lee is associated with Ichia Technologies, Inc., a leading company specializing in the design and manufacturing of advanced electronic components. His work at Ichia Technologies has greatly contributed to the company's mission to bring innovative solutions to market, strengthening its position in the competitive electronics sector.

Collaborations

Throughout his career, Ying-Wei Lee has collaborated with notable coworkers such as Chien-Hwa Chiu and Chih-Min Chao. These partnerships reflect the collective effort within Ichia Technologies to innovate and implement cutting-edge technologies for circuit boards, ensuring their products meet the evolving demands of the electronics industry.

Conclusion

In summary, Ying-Wei Lee stands out as a prominent inventor with a notable focus on circuit board technology. His patents demonstrate a blend of ingenuity and practicality, allowing for advancements that benefit both manufacturers and consumers. As he continues to evolve within Ichia Technologies, the electronics industry can anticipate further innovations stemming from his expertise.