Ichia Technologies, Inc.

Ying-Wei Lee

Chia-Hua Chiang

Chih-Min Chao

Chih-Cheng Hsiao

Chien-Hwa Chiu

Feng-Ping Kuan

Peir-Rong Kuo

Yung-Chang Juang

Wei-Cheng Lee

A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.

Method of manufacturing printed circuit board

A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).

Flexible circuit board and process for producing the same

Growing community of inventors

Taoyuan County, Taiwan

Ying-Wei Lee