The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Aug. 15, 2013
Ichia Technologies,inc., Taoyuan County, TW;
Chien-Hwa Chiu, Taoyuan County, TW;
Chih-Min Chao, Taoyuan County, TW;
Peir-Rong Kuo, Taoyuan County, TW;
Chia-Hua Chiang, Taoyuan County, TW;
Chih-Cheng Hsiao, Taoyuan County, TW;
Feng-Ping Kuan, Taoyuan County, TW;
Ying-Wei Lee, Taoyuan County, TW;
Yung-Chang Juang, Taoyuan County, TW;
ICHIA TECHNOLOGIES, INC., Taoyuan, TW;
Abstract
A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).