The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2016
Filed:
Oct. 21, 2013
Ichia Technologies, Inc., Taoyuan County, TW;
Chien-Hwa Chiu, Taoyuan County, TW;
Chih-Min Chao, Taoyuan County, TW;
Peir-Rong Kuo, Taoyuan County, TW;
Chia-Hua Chiang, Taoyuan County, TW;
Chih-Cheng Hsiao, Taoyuan County, TW;
Feng-Ping Kuan, Taoyuan County, TW;
Ying-Wei Lee, Taoyuan County, TW;
Wei-Cheng Lee, Taoyuan County, TW;
ICHIA TECHNOLOGIES, INC., Taoyuan County, unknown;
Abstract
A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.