Ying Wang

Title: Ying Wang - Innovator in Electrical Engineering

Introduction

Ying Wang is a notable inventor based in Wheeling, IL (US). He has made significant contributions to the field of electrical engineering, particularly in methods for securing conductive interconnects and metallic substrates. With a total of 3 patents to his name, Wang's work has implications for various electronic applications.

Latest Patents

Wang's latest patents include a "Method and apparatus for securing an electrically conductive interconnect through a metallic substrate." This innovative method involves forming a hole in a metallic substrate, applying an electrically insulating layer, and solder bonding the conductive interconnect within the hole. Another significant patent is the "Method and apparatus for securing a metallic substrate to a metallic housing." This method details the process of joining a metallic substrate to a housing to create a hermetic seal, enhancing the durability and reliability of electronic devices.

Career Highlights

Ying Wang is currently employed at Motorola Corporation, where he continues to develop and refine his innovative techniques. His work has been instrumental in advancing the technology used in electronic control modules, showcasing his expertise in the field.

Collaborations

Wang has collaborated with notable colleagues, including Clark D Fischbach and Robert A Richter, Jr. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Ying Wang's contributions to electrical engineering through his patents and work at Motorola Corporation highlight his role as a key innovator in the industry. His methods for securing conductive interconnects and metallic substrates are paving the way for advancements in electronic technology.