The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2004
Filed:
Mar. 21, 2002
Stanton Rak, Evanston, IL (US);
Ying Wang, Wheeling, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method and module for securing a conductive interconnect ( ) through a metallic substrate ( ). The method includes the steps of: forming a hole ( ) in the metallic substrate ( ), the hole ( ) defined by an internal surface ( ) of the metallic substrate ( ); applying an electrically insulating layer ( ) to the metallic substrate ( ) including the internal surface ( ); applying a solderable coating ( ) to at least a portion of the electrically insulating layer ( ) around the hole ( ); applying a solder ( ) to at least a portion of the solderable coating ( ) at and above the hole ( ); inserting the conductive interconnect ( ) through the hole ( ); and solder bonding the conductive interconnect ( ) within the hole ( ).