The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2004

Filed:

Mar. 21, 2002
Applicant:
Inventors:

Ying Wang, Wheeling, IL (US);

Thomas P. Gall, Northbrook, IL (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/20 ; B23K 3/102 ; B23K 2/016 ; B23K 2/022 ; B23K 3/524 ;
U.S. Cl.
CPC ...
B23K 1/20 ; B23K 3/102 ; B23K 2/016 ; B23K 2/022 ; B23K 3/524 ;
Abstract

A method for securing a metallic substrate ( ) to a metallic housing ( ). The method may include: firing a first solderable coating ( ) to an edge ( ) of the metallic substrate ( ); firing a second solderable coating ( ) to a groove ( ) of the metallic housing ( ); joining the edge ( ) of the metallic substrate ( ) to the groove ( ) of the metallic housing ( ) to form a joint ( ) at the first solderable coating and the second solderable coating; applying a solder ( ) to the joint ( ); and solder bonding the metallic substrate ( ) to the metallic housing ( ) to provide a hermetic seal at the joint ( ). There is also an electronic control module that incorporates the method.


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