Motorola Corporation

Ying Wang

Thomas P Gall

Clark D Fischbach

Stanton Rak

Robert A Richter, Jr

A method and module for securing a conductive interconnect ( ) through a metallic substrate ( ). The method includes the steps of: forming a hole ( ) in the metallic substrate ( ), the hole ( ) defined by an internal surface ( ) of the metallic substrate ( ); applying an electrically insulating layer ( ) to the metallic substrate ( ) including the internal surface ( ); applying a solderable coating ( ) to at least a portion of the electrically insulating layer ( ) around the hole ( ); applying a solder ( ) to at least a portion of the solderable coating ( ) at and above the hole ( ); inserting the conductive interconnect ( ) through the hole ( ); and solder bonding the conductive interconnect ( ) within the hole ( ).

Method and apparatus for securing an electrically conductive interconnect through a metallic substrate

A method for securing a metallic substrate ( ) to a metallic housing ( ). The method may include: firing a first solderable coating ( ) to an edge ( ) of the metallic substrate ( ); firing a second solderable coating ( ) to a groove ( ) of the metallic housing ( ); joining the edge ( ) of the metallic substrate ( ) to the groove ( ) of the metallic housing ( ) to form a joint ( ) at the first solderable coating and the second solderable coating; applying a solder ( ) to the joint ( ); and solder bonding the metallic substrate ( ) to the metallic housing ( ) to provide a hermetic seal at the joint ( ). There is also an electronic control module that incorporates the method.

Method and apparatus for securing a metallic substrate to a metallic housing

An electronic control module is provided wherein a power device is secured to a rigidizer, or heat spreader, such that a thermally conductive path is created for a conduction of heat from the power device to the rigidizer. A thermally conductive and electrically insulated interface , preferably anodized aluminum, is disposed between device and rigidizer and is solder bonded to each of the device and the rigidizer, facilitating the creation of a thermal path from the device to the rigidizer. In order to solder bond the device to the interface and the interface to the rigidizer, solderable coatings are respectively applied to the surfaces and of the interface and surface of the rigidizer.

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Wheeling, IL, United States of America

Ying Wang