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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Ying-Te Ou

USPTO Granted Patents = 16 

Average Co-Inventor Count = 2.3

ph-index = 4

Forward Citations = 41(Granted Patents)


Company Filing History:

goldMedal16 out of 1,872 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2011-2023

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16 patents (USPTO):Explore Patents
1. 11806710 - Semiconductor package structures and methods of manufacturing the same (2023-11-07),
2. 10600759 - Power and ground design for through-silicon via structure (2020-03-24),
3. 10236208 - Semiconductor package structure and method of manufacturing the same (2019-03-19),
4. 9768103 - Fabrication method of embedded chip substrate (2017-09-19),
5. 9728451 - Through silicon vias for semiconductor devices and manufacturing method thereof (2017-08-08),
6. 9711473 - Semiconductor die, semiconductor wafer and method for manufacturing the same (2017-07-18),
7. 9253887 - Fabrication method of embedded chip substrate (2016-02-02),
8. 8963316 - Semiconductor device and method for manufacturing the same (2015-02-24),
9. 8937387 - Semiconductor device with conductive vias (2015-01-20),
10. 8841751 - Through silicon vias for semiconductor devices and manufacturing method thereof (2014-09-23),
11. 8653634 - EMI-shielded semiconductor devices and methods of making (2014-02-18),
12. 8486829 - Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via (2013-07-16),
13. 8350361 - Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via (2013-01-08),
14. 8222707 - Semiconductor package structure and package method thereof (2012-07-17),
15. 8120148 - Package structure with embedded die and method of fabricating the same (2012-02-21),

Title: **Innovative Contributions of Ying-Te Ou in Semiconductor Technology**

Introduction

Ying-Te Ou, a distinguished inventor based in Kaohsiung, Taiwan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 16 patents, he has played a pivotal role in advancing semiconductor package structures and methodologies.

Latest Patents

Among Ou's latest innovations are two notable patents focused on semiconductor package structures and methods of manufacturing them. The first patent outlines a unique semiconductor package structure that comprises a substrate, a die, and a conductive structure, which ensures reliable electrical connections. This structure features a sensing region strategically positioned adjacent to the die's first edge, optimized for efficient functionality. The second patent addresses power and ground design within a through-silicon via structure. This invention encompasses a substrate, dielectric layer, and conductive layer, innovatively arranged to enhance the electrical connection between components, significantly amplifying the performance of semiconductor devices.

Career Highlights

Ying-Te Ou is affiliated with Advanced Semiconductor Engineering, Inc., where his expertise has been integral to the company’s mission of providing cutting-edge semiconductor solutions. His role emphasizes innovations that enhance packaging technology, which is critical to the modern electronic landscape.

Collaborations

Throughout his career, Ou has collaborated with esteemed colleagues, including Chih-Pin Hung and Chin-Cheng Kuo. These partnerships have fostered a creative environment conducive to breakthrough advancements in semiconductor technology, showcasing the power of teamwork in the realm of innovation.

Conclusion

Ying-Te Ou's contributions to semiconductor technology reflect a profound commitment to advancing the field. His 16 patents serve as a testament to his innovative spirit and technical expertise, positioning him as a notable figure in the semiconductor industry. As technology continues to evolve, his work will undoubtedly inspire future advancements.

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