The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Feb. 15, 2012
Chih-jing Hsu, Kaohsiung, TW;
Ying-te Ou, Kaohsiung, TW;
Chieh-chen Fu, Kaohsiung, TW;
Che-hau Huang, Kaohsiung, TW;
Chih-Jing Hsu, Kaohsiung, TW;
Ying-Te Ou, Kaohsiung, TW;
Chieh-Chen Fu, Kaohsiung, TW;
Che-Hau Huang, Kaohsiung, TW;
Abstract
The present invention relates to a semiconductor device and a method for making the same. The semiconductor device includes a substrate, a first redistribution layer and a conductive via. The substrate has a substrate body and a pad. The pad and the first redistribution layer are disposed adjacent to the first surface of the substrate body, and electrically connected to each other. The interconnection metal is disposed in a through hole of the substrate body, and contacts the first redistribution layer. Whereby, the pad can be electrically connected to the second surface of the substrate body through the first redistribution layer and the conductive via.