Kaohsiung, Taiwan

Chieh-Chen Fu

USPTO Granted Patents = 10 

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 39(Granted Patents)


Company Filing History:


Years Active: 2012-2025

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10 patents (USPTO):Explore Patents

Title: Innovations of Chieh-Chen Fu

Introduction

Chieh-Chen Fu is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on advancing the capabilities and efficiency of semiconductor devices.

Latest Patents

Among his latest patents is a method for manufacturing a semiconductor package device. This innovative package includes a first semiconductor device with a first surface, an interconnection element that is coplanar with the first surface, and a first encapsulant that encapsulates both the semiconductor device and the interconnection element. Additionally, a second semiconductor device is positioned across the first semiconductor device and the interconnection element. Another notable patent is for a communication device, which may function as an optical device, a light coupling device, or a tunable light coupling device. This device comprises a first portion, a lens, a light-emitting element, and a waveguide, showcasing the versatility and potential applications of his inventions.

Career Highlights

Chieh-Chen Fu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate and develop new technologies in the semiconductor industry. His expertise and dedication have positioned him as a key figure in his field.

Collaborations

He has collaborated with notable coworkers, including Cheng-Nan Lin and I-Chia Lin, contributing to various projects that enhance the functionality and performance of semiconductor devices.

Conclusion

Chieh-Chen Fu's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to pave the way for advancements in communication and semiconductor packaging.

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