Ying-Hua Chen

Title: Innovations of Ying-Hua Chen

Introduction

Ying-Hua Chen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative methods for fabricating photonic devices and semiconductor components.

Latest Patents

One of his latest patents is titled "Photonic package device and method for fabricating the same." This invention provides a method for fabricating a photonic package device, which includes patterning a semiconductor layer of a semiconductor-on-insulator (SOI) substrate into a waveguide structure and at least one first semiconductor pillar. The process involves forming a metal-dielectric stack over the waveguide structure and the first semiconductor pillar, etching an opening in the stack to expose the first semiconductor pillar, and creating insulator caps and second semiconductor pillars below the first semiconductor pillar. Another notable patent is related to the "Methods of manufacturing semiconductor device and semiconductor device." This method outlines the steps for forming interlayer dielectric layers, creating trench openings, and establishing process marks within the semiconductor structure.

Career Highlights

Ying-Hua Chen is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in photonic and semiconductor technologies has positioned him as a key player in advancing these fields.

Collaborations

Throughout his career, Chen has collaborated with notable colleagues, including Wen-Chen Lu and Jui-Yu Pan. These partnerships have contributed to the development of innovative solutions in semiconductor manufacturing.

Conclusion

Ying-Hua Chen's contributions to semiconductor technology and photonic devices highlight his role as an influential inventor. His patents reflect a commitment to advancing the industry through innovative methods and collaborative efforts.