Ying-Chih Chen

Title: Innovations by Inventor Ying-Chih Chen

Introduction: Ying-Chih Chen is a renowned inventor based in Kaohsiung, Taiwan, holding an impressive portfolio of seven patents. His work primarily focuses on advancements in semiconductor technology, showcasing his expertise in creating efficient electronic components.

Latest Patents: Among his most recent innovations, Chen has developed a semiconductor package that features a substrate, an electronic component, a dielectric layer, a transmitting antenna, a receiving antenna, and a Frequency Selective Surface (FSS) antenna. This design strategically positions the electronic component on the substrate while ensuring the FSS antenna operates effectively by being separated from the substrate by the dielectric layer in a wireless signal emitting direction. Another significant patent of his is a semiconductor package assembly, which includes a first substrate, with a first semiconductor die and a passive device located directly on it, effectively maximizing space and performance.

Career Highlights: Throughout his career, Ying-Chih Chen has significantly contributed to the field of semiconductor engineering while working for prominent companies, including MediaTek Corporation and Advanced Semiconductor Engineering, Inc. His work in these organizations has allowed him to push the boundaries of electronics and semiconductor applications.

Collaborations: Chen has also collaborated with notable professionals in his field, such as Hsing-Chih Liu and Chia-Hao Yang. These partnerships have fostered innovative developments and further advancements in semiconductor technology.

Conclusion: As an inventor, Ying-Chih Chen continues to revolutionize the sector of semiconductor packaging and assembly. His seven patents reflect his dedication to innovation and excellence, positioning him as a key figure in the advancement of electronic components. Through collaborative efforts and a keen understanding of technology, he remains a driving force in the industry.