Yih-Shung Lin

Title: Yih-Shung Lin: Innovator in Integrated Circuit Technology

Introduction

Yih-Shung Lin is a prominent inventor based in Singapore, known for his significant contributions to the field of integrated circuit technology. With a total of 7 patents to his name, Lin has developed innovative methods that enhance the performance and reliability of electronic devices.

Latest Patents

Among his latest patents is the "Enhanced planarization technique for an integrated circuit." This method involves a unique process for planarizing integrated circuit topographies, which includes the deposition of a first layer of spin-on glass, followed by a layer of low-temperature oxide, and then a second layer of spin-on glass. Another notable patent is the "Titanium nitride/titanium tungsten alloy composite barrier layer for integrated circuits." This invention outlines a method for forming a barrier layer upon an electrode contact, which includes the formation of a titanium layer over a silicon substrate layer and the thermal processing of this layer in a nitrogen-containing atmosphere to create a titanium silicide layer and a titanium nitride layer.

Career Highlights

Yih-Shung Lin has worked with leading companies in the semiconductor industry, including Chartered Semiconductor Manufacturing Ltd and STMicroelectronics GmbH. His work in these organizations has been instrumental in advancing integrated circuit technologies.

Collaborations

Lin has collaborated with notable professionals in his field, including Charles Lin and Erzhuang Liu. Their combined expertise has contributed to the successful development of innovative technologies in integrated circuits.

Conclusion

Yih-Shung Lin's contributions to integrated circuit technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced electronic devices.