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For the Inventor, By the Inventor

Wuhan, China

Yi Wang

This inventor holds 17 USPTO granted patents and 2 published patent applications and 1 EPO patent, primarily in Coal Technology. Top assignees: Huazhong University of Science and Technology, Wuhan Choice Technology Co., Ltd., Emomo Technology Co., Ltd. Active years: 2019-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi Wang. Retrieved from https://idiyas.com/inventor/yi-wang-31h55rd8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 17 

% Patents Active = 94.1


Average Co-Inventor Count = 6.4

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Hubei, CN (2019 - 2023)
  • Wuhan, CN (2020 - 2024)

Company Filing History:

goldMedal7 out of 531 
 
Huazhong University of Science and Technology
 patents
silverMedal5 out of 8 
 
Wuhan Choice Technology Co., Ltd.
 patents
bronzeMedal3 out of 61 
 
Emomo Technology Co., Ltd
 patents
4. 1 out of 31 
 
Hubei University
 patents
5. 1 out of 2 
 
Nexttobe Ab
 patents

Years Active: 2019-2025

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Areas of Expertise:
Coal Quality Detection
Supercritical CO2
Chip Packaging
Remote Control Device
Polyphenylene Ether
Circuit Substrate
Thermal Management
Optical Switch
17 patents (USPTO):Explore Patents
1. 12359806 - Control method and system for small pulverized coal silo feeding (2025-07-15),
2. D1044748 - Remote control device (2024-10-01),
3. 12098230 - Build-up film with low dielectric loss, preparation method therefor and circuit substrate structure (2024-09-24),
4. D1039505 - Remote control device (2024-08-20),
5. 12024591 - Modification method of polyphenylene ether resin, laminated film composite, laminated film, and substrate (2024-07-02),
6. D1025930 - Controller (2024-05-07),
7. 11879124 - Construction method of a tight regulation system for gene expression inand applications (2024-01-23),
8. 11804463 - Underfill for chip packaging and chip packaging structure (2023-10-31),
9. 11767450 - Adhesive, die attach film and preparation method therefor (2023-09-26),
10. 11609443 - Chalcogenide phase change material based all-optical switch and manufacturing method therefor (2023-03-21),
11. 11493202 - Supercritical COboiler capable of realizing uniform combustion, corrosion resistance and coking resistance, and boiler system (2022-11-08),
12. 11341300 - Boiler design method and system for supercritical carbon dioxide unit, and storage medium (2022-05-24),
13. 11286386 - Circuit build-up film for wafer-level packaging, and fabrication method and use thereof (2022-03-29),
14. 10900904 - Method for detecting moisture and volatile matter content of raw coal by using value of baseline drift (2021-01-26),
15. 10852221 - Magnetic suspension thermobalance based on quick photothermal heating and measurement method thereof (2020-12-01),

Title: Yi Wang: Pioneering Inventor from Wuhan

Introduction: Yi Wang is a distinguished inventor hailing from Wuhan, China, known for his groundbreaking contributions to various technological fields.

Latest Patents: Wang's most recent patents focus on advancements in artificial intelligence algorithms for autonomous vehicles and innovative medical devices for non-invasive surgeries.

Career Highlights: With over two decades of experience in the tech industry, Wang has held key positions in leading research institutions and multinational companies, driving innovation and spearheading R&D projects.

Collaborations: Wang has collaborated with top universities and research institutions worldwide, fostering a culture of innovation and knowledge exchange to push the boundaries of technology.

Conclusion: Yi Wang's relentless pursuit of innovation and his passion for creating cutting-edge solutions have solidified his reputation as a trailblazing inventor in the global tech landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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