The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Aug. 31, 2023
Applicant:

Wuhan Choice Technology Co, Ltd, Wuhan, CN;

Inventors:

De Wu, Wuhan, CN;

Yi Wang, Wuhan, CN;

Shuhang Liao, Wuhan, CN;

Junxing Su, Wuhan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 212/08 (2006.01); C08F 232/08 (2006.01); C08G 65/48 (2006.01); C08G 81/02 (2006.01); C08J 5/18 (2006.01); C08K 7/18 (2006.01); C08L 71/12 (2006.01);
U.S. Cl.
CPC ...
C08G 65/485 (2013.01); C08J 5/18 (2013.01); C08K 7/18 (2013.01); C08L 71/126 (2013.01); C08F 212/08 (2013.01); C08F 232/08 (2013.01); C08G 81/025 (2013.01); C08G 2261/126 (2013.01); C08J 2353/00 (2013.01); C08J 2371/12 (2013.01); C08L 2203/16 (2013.01);
Abstract

The present disclosure provides a method for modifying a polyphenylene ether resin, a laminated film composite, a laminated film, and a substrate. The method for modifying a polyphenylene ether resin using an indene oligomer to reduce the molecular weight of the polyphenylene ether to obtain an indene oligomer-modified polyphenylene ether resin. The modified polyphenylene ether with a smaller molecular weight has a lower softening point and melting point, a better interfacial adhesion, and can be better adhered to a substrate of an integrated circuit. Meanwhile, because it has a lower dielectric constant and dielectric loss, the dielectric constant and dielectric loss of the substrate can be reduced, thereby solving the technical problem of electric leakage and heat generation caused when the existing polyphenylene ether resin is applied to an integrated circuit when the feature size of the integrated circuit is reduced.


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