The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Apr. 26, 2023
Wuhan Choice Technology Co, Ltd, Wuhan, CN;
De Wu, Wuhan, CN;
Shengquan Wang, Wuhan, CN;
Yi Wang, Wuhan, CN;
Shuhang Liao, Wuhan, CN;
Junxing Su, Wuhan, CN;
Wuhan Choice Technology Co, Ltd, Wuhan, CN;
Abstract
The present application discloses an underfill for chip packaging, including 19-25% of epoxy resin, 55-60% of filler, 15-25% of curing agent and 0.5-0.8% of accelerator in mass percentage, wherein the curing agent includes a polycondensate of paraxylene and dihydroxynaphthalene and a polycondensate of paraxylene and naphthol. Both of the polycondensate of paraxylene and dihydroxynaphthalene and the polycondensate of paraxylene and naphthol are selected to be used in the underfill for chip packaging in the present application, so that the underfill has stronger adhesiveness after being cured. In addition, the present application further provides a chip packaging structure using the underfill.