The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Nov. 30, 2023
Applicant:

Wuhan Choice Technology Co, Ltd, Wuhan, CN;

Inventors:

De Wu, Wuhan, CN;

Yi Wang, Wuhan, CN;

Shuhang Liao, Wuhan, CN;

Junxing Su, Wuhan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); C08F 283/00 (2006.01); C08F 283/04 (2006.01); C08G 73/12 (2006.01); C08K 3/36 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
C08F 283/00 (2013.01); C08F 283/045 (2013.01); C08G 73/12 (2013.01); C08J 5/18 (2013.01); C08K 3/36 (2013.01); H05K 3/22 (2013.01); C08J 2351/08 (2013.01);
Abstract

A build-up film with low dielectric loss, a preparation method therefor, and a circuit substrate structure are provided. The build-up film is prepared from raw materials including 5-10 parts by mass of monofunctional benzoxazine having indene oligomer, 40-65 parts by mass of polymerized aromatic-based maleimide, 30-50 parts by mass of allyl benzoxazine, 0.1-3 parts by mass of initiator, 250-400 parts by mass of inorganic filler, and 0.1-5 parts by mass of silane coupling agent. The build-up film has low dielectric loss and high tensile strength. Low dielectric loss enables it to be applied in the field of 5G. For example, the build-up film can be used to packaging integrated circuit substrates, which is conducive to minimizing the transmission loss.


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