Yi-Tzeng Lin

Title: Yi-Tzeng Lin: Innovator in Semiconductor Technology

Introduction

Yi-Tzeng Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to semiconductor packaging and wiring substrates.

Latest Patents

Yi-Tzeng Lin's latest patents include a semiconductor package device and a semiconductor wiring substrate. The semiconductor wiring substrate features a first circuit layer and a second circuit layer, with a first dielectric layer positioned between them. This design incorporates a plurality of first signal traces and ground traces that are alternately arranged, optimizing the spacing for enhanced performance. His other patent, the interposer routing structure, includes multiple trace layers designed to efficiently manage power and signal distribution, ensuring that ground traces effectively isolate power traces.

Career Highlights

Throughout his career, Yi-Tzeng Lin has worked with notable companies such as Global Unichip Corporation and Taiwan Semiconductor Manufacturing Company Ltd. His experience in these leading firms has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Yi-Tzeng Lin has collaborated with esteemed colleagues, including Sheng-Fan Yang and Wei-Chiao Wang. These partnerships have fostered a creative environment that has led to innovative solutions in the semiconductor industry.

Conclusion

Yi-Tzeng Lin's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor packaging and wiring solutions.