Tainan, Taiwan

Yi-Chung Liang

This inventor holds 4 USPTO granted patents and 3 published patent applications. Top assignees: Powerchip Semiconductor Manufacturing Corporation, Powerchip Technology Corporation. Active years: 2016-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Chung Liang. Retrieved from https://idiyas.com/inventor/yi-chung-liang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 4 

% Patents Active = 100.0

Average Co-Inventor Count = 1.2

ph-index = 1


Company Filing History:


Years Active: 2016-2023

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4 patents (USPTO):Explore Patents

Title: Yi-Chung Liang: Innovator in Semiconductor Technology

Introduction

Yi-Chung Liang is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative work focuses on manufacturing methods and semiconductor devices that enhance performance and efficiency.

Latest Patents

One of Yi-Chung Liang's latest patents is titled "Semiconductor device and manufacturing method thereof." This patent outlines a manufacturing method that includes several steps, such as providing a substrate with a stacked structure and performing an epitaxy process to form an epitaxial layer. The method also involves creating a recess that penetrates through the epitaxial layer and extends into the substrate, where a source/drain region is formed using silicon germanium. Additionally, a spacer wall material layer is created on the substrate, and a gate structure is formed by removing a portion of the stacked structure.

Another notable patent is "Semiconductor package and manufacturing method thereof." This patent describes a semiconductor package that includes a chip stack structure, a redistribution layer (RDL) structure, and conductive plugs. The chip stack structure consists of stacked chips, each equipped with pads located on the same side. The RDL structure is positioned on the first sidewall of the chip stack and is adjacent to the pads, with conductive plugs penetrating through the RDL structure to connect to the corresponding pads.

Career Highlights

Yi-Chung Liang has worked with several notable companies in the semiconductor industry, including Powerchip Semiconductor Manufacturing Corporation and Powerchip Technology Corporation. His experience in these organizations has contributed to his expertise in semiconductor manufacturing and innovation.

Collaborations

Throughout his career, Yi-Chung Liang has collaborated with talented individuals such as Chen-Hao Huang and Li-Wei Liu. These collaborations have likely fostered a creative environment that has led to the development of groundbreaking technologies in the semiconductor field.

Conclusion

Yi-Chung Liang is a distinguished inventor whose work in semiconductor technology has resulted in multiple patents and significant advancements in the industry. His contributions continue to shape the future of semiconductor manufacturing and innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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