Yi-Bae Choi

Title: Innovations by Yi-Bae Choi in Three-Dimensional Measurement Technology

Introduction

Yi-Bae Choi is a notable inventor based in Taejeon, South Korea. He has made significant contributions to the field of three-dimensional measurement technology. With a total of two patents to his name, Choi's work focuses on innovative methods and apparatuses for accurately measuring the three-dimensional surface shapes of objects.

Latest Patents

Choi's latest patents include a method and apparatus for measuring the three-dimensional surface shape of an object using color information from light reflected by the object. This innovative approach allows for real-time measurement by projecting a beam of light with color information onto the object. The system detects color distribution information according to the object's levels, thus obtaining precise level information.

Another significant patent involves a method and apparatus for measuring the three-dimensional shape of an object using a moiré equipment. This method includes obtaining a grid pattern image projected on a reference plane of a moving table and applying a buckets algorithm to achieve a reference phase. It then calculates the difference phase between the object phase and the reference phase, allowing for the unwrapping of the moiré phase to achieve level information of the object. This technology enhances compactness, simplicity in usage, and reduces manufacturing costs.

Career Highlights

Yi-Bae Choi is currently associated with Intekplus Co., Ltd., where he continues to develop and refine his innovative technologies. His work has positioned him as a key figure in the advancement of measurement technologies.

Collaborations

Choi has collaborated with notable colleagues, including Ssang-Gun Lim and Sang-Yoon Lee, contributing to the success of various projects and innovations.

Conclusion

Yi-Bae Choi's contributions to three-dimensional measurement technology demonstrate his commitment to innovation and excellence in his field. His patents reflect a deep understanding of the complexities involved in accurately measuring object shapes, paving the way for future advancements in technology.