Hwaseong, South Korea

Yeongseok Kim

This inventor holds 16 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yeongseok Kim. Retrieved from https://idiyas.com/inventor/yeongseok-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 2016-2026

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Areas of Expertise:
Semiconductor Package
Thermal Conductive Film
Flip Chip Bonding
Debonding Tape
Processing Tape
Non-Conductive Film
Adhesive Film
Fan-Out Panel Level Package
Mold Layer
Semiconductor Manufacturing
Wafer Processing
Carrier Tape Film
16 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Inventor Yeongseok Kim

Introduction

Yeongseok Kim is a prominent inventor based in Hwaseong-si, South Korea, with an impressive portfolio of 15 patents to his name. His work primarily focuses on advancements in adhesive technologies and semiconductor processing methods, which play a critical role in modern electronics.

Latest Patents

Kim's latest patents showcase his ingenuity and expertise in the field. One of his notable inventions is a debonding tape and method of processing semiconductor wafers using the same. This innovative debonding tape includes a first tape layer with specific properties that enhance its performance. The tape is designed with a first layer containing a unique adhesive that ensures optimal adhesion while maintaining a specific diameter. Supporting this is a second tape layer that strengthens the first layer, providing a superior method for the processing of semiconductor wafers.

Additionally, Kim has developed a thermal conductive film, which includes a porous metal layer filled with adhesive substances to enhance thermal conductivity. This film is equipped with thermal conductive members distributed within the adhesive layer, optimizing heat management in electronic devices.

Career Highlights

Kim is associated with Samsung Electronics Co., Ltd., where he has significantly contributed to innovation in adhesive technologies. His role at the company has allowed him to leverage his inventive skills to create products that meet the demands of the ever-evolving electronics industry.

Collaborations

Throughout his career, Yeongseok Kim has collaborated with talented coworkers, including Hyein Yoo and Joungphil Lee. These partnerships have undoubtedly fostered a creative environment that encourages the development of groundbreaking inventions and solutions in the electronics sector.

Conclusion

Yeongseok Kim stands out as a visionary inventor whose patents reflect his commitment to technological advancement. His contributions, particularly in adhesive technologies and semiconductor processing, are paving the way for innovations that enhance the performance and efficiency of electronic devices. As he continues his work at Samsung Electronics Co., Ltd., anticipation grows for future inventions that will further transform the landscape of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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