The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Aug. 14, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Joungphil Lee, Suwon-si, KR;
Myung-Sung Kang, Yongin-si, KR;
Yeongseok Kim, Hwaseong-si, KR;
Gwangsun Seo, Jeonju-si, KR;
Hyein Yoo, Suwon-si, KR;
Yongwon Choi, Hwaseong-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/28 (2018.01); C09J 11/04 (2006.01); H01L 23/373 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); C09J 7/28 (2018.01); C09J 11/04 (2013.01); H01L 23/295 (2013.01); H01L 23/3135 (2013.01); H01L 23/5385 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 23/367 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/2916 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29388 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/30505 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01);
Abstract
An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.