The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Mar. 03, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hwail Jin, Seongnam-si, KR;

Seon Ho Lee, Cheonan-si, KR;

Yeongseok Kim, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); C09J 7/24 (2018.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 7/241 (2018.01); C09J 7/385 (2018.01); C09J 7/401 (2018.01); C09J 7/403 (2018.01); H01L 21/78 (2013.01); C09J 2423/006 (2013.01); C09J 2433/005 (2013.01); C09J 2483/005 (2013.01); Y10T 428/14 (2015.01); Y10T 428/1457 (2015.01); Y10T 428/1476 (2015.01);
Abstract

A processing tape may include a base layer, an adhesive layer disposed on the base layer, a protection release film on the adhesive layer, and a first release layer interposed between the adhesive layer and the protection release film. The first release layer may include a silicone-based material and may be non-photo-curable.


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