Portland, OR, United States of America

Yen-Cheng Liu

USPTO Granted Patents = 70 

 

Average Co-Inventor Count = 5.3

ph-index = 8

Forward Citations = 203(Granted Patents)

Forward Citations (Not Self Cited) = 187(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:


Years Active: 2008-2025

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Areas of Expertise:
High Performance Interconnect
Multiple Dies Hardware Processors
Remote Atomic Operations
Cache Coherency
Memory Architecture
Disaster Recovery
Shared Cache
Snoop Filtering
Virtual Shared Cache
Adaptive Interconnect Routing
Energy Optimization
Low Latency Interconnect
70 patents (USPTO):Explore Patents

Title: Innovations by Yen-Cheng Liu: A Visionary in High-Performance Interconnect Technology

Introduction

Yen-Cheng Liu is a notable inventor based in Portland, OR, USA, recognized for his significant contributions to the field of high-performance interconnect technology. With an impressive portfolio of 68 patents, Liu has driven innovations that enhance the efficiency and functionality of communication systems in modern technology.

Latest Patents

Among his latest patents is the development of a high-performance interconnect, which revolves around a physical layer (PHY) coupled to a serial, differential link that supports multiple lanes. The invention encompasses a transmitter and receiver configured for each lane, enabling the embedding of a clock with the data transmitted over these lanes. A key feature of the PHY is the periodic issuance of a blocking link state (BLS) request, which prompts an agent to enter a low-power or partial-width state for specific PHY-related tasks. This design not only optimizes performance but also minimizes energy consumption during data transmission processes.

Career Highlights

Yen-Cheng Liu has established a remarkable career at Intel Corporation, where he continues to spearhead groundbreaking projects in communication technologies. His dedication to innovation has earned him recognition and respect among peers and industry leaders alike.

Collaborations

Liu’s work at Intel Corporation has allowed him to collaborate with several talented individuals, including Krishnakanth Venkata Sistla and Bahaa Fahim. These partnerships have fostered an environment of creativity and technological advancement, further pushing the boundaries of what's possible in high-performance interconnects.

Conclusion

Through his extensive work, Yen-Cheng Liu exemplifies the spirit of innovation. His contributions to interconnect technology not only enhance the performance of communication systems but also pave the way for future advancements in the field. As he continues to explore new technologies and methodologies, his legacy as an inventor will surely inspire future generations in the world of innovation.

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