Company Filing History:
Years Active: 2011
Title: Yeh-Shun Chen: Innovator in Fingerprint Sensor Technology
Introduction
Yeh-Shun Chen is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of fingerprint sensor technology, holding 2 patents that showcase his innovative approach to packaging and sensor design.
Latest Patents
One of his latest patents is titled "Package, packaging method and substrate thereof for sliding type thin fingerprint sensor." This invention primarily focuses on a sliding type thin fingerprint sensor package that includes a substrate and a fingerprint sensor chip. The design features a dielectric layer, a circuit layer, and a passivation layer, with external contact pads and an electrostatic conductive pad strategically placed for optimal functionality. The fingerprint sensor chip is electronically connected to the substrate, allowing for effective sensing through a specially designed opening.
Another notable patent is the "Sliding type thin fingerprint sensor package," which also emphasizes the integration of a substrate, fingerprint sensor chip, and a metal plate. This design ensures that the sensing region of the fingerprint sensor chip is effectively exposed, enhancing the overall performance of the device. The collaboration between the metal plate and the substrate further optimizes the sensor's functionality.
Career Highlights
Yeh-Shun Chen is currently employed at Chipbond Technology Corporation, where he continues to innovate in the field of semiconductor technology. His work has significantly impacted the development of advanced fingerprint sensing solutions, making him a key figure in this industry.
Collaborations
Throughout his career, Yeh-Shun Chen has collaborated with talented individuals such as Yung-Jen Chen and Charles Yang. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Yeh-Shun Chen's contributions to fingerprint sensor technology exemplify his innovative spirit and dedication to advancing the field. His patents reflect a deep understanding of the complexities involved in sensor design and packaging, positioning him as a leading inventor in this domain.