The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
Sep. 19, 2007
Charles Yang, Kaohsiung, TW;
Yeh-shun Chen, Kaohsiung, TW;
Yung-jen Chen, Kaohsiung, TW;
Wei-te Chu, Kaohsiung, TW;
Tun-yu Chen, Kaohsiung, TW;
Charles Yang, Kaohsiung, TW;
Yeh-Shun Chen, Kaohsiung, TW;
Yung-Jen Chen, Kaohsiung, TW;
Wei-Te Chu, Kaohsiung, TW;
Tun-Yu Chen, Kaohsiung, TW;
Chipbond Technology Corporation, Hsinchu, TW;
Abstract
A sliding type thin fingerprint sensor package mainly comprises a substrate and a fingerprint sensor chip. The chip defined as a sliding region and a conductive portion comprises a dielectric layer, a circuit layer and a passivation layer. The circuit layer has a plurality of external contact pads and at least one electrostatic conductive pad close to a window of the dielectric layer. The passivation layer formed on the circuit layer has a plurality of first openings to expose the external contact pads and a second opening to expose the electrostatic conductive pad of the circuit layer and the window of the dielectric layer. The electrostatic conductive pad and the window are located at the sliding region and the external contact pads are located at the conductive portion. The fingerprint sensor chip is electronically connected with the substrate. A sensing region of the fingerprint sensor chip is exposed via the second opening of the passivation layer and the window of the dielectric layer.