Wei-Te Chu

Title: Innovations of Wei-Te Chu in Fingerprint Sensor Technology

Introduction

Wei-Te Chu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of fingerprint sensor technology. His innovative work has led to the development of a unique packaging method for sliding type thin fingerprint sensors.

Latest Patents

Wei-Te Chu holds a patent for a "Package, packaging method and substrate thereof for sliding type thin fingerprint sensor." This invention primarily comprises a substrate and a fingerprint sensor chip. The chip is defined as a sliding region and a conductive portion, which includes a dielectric layer, a circuit layer, and a passivation layer. The circuit layer features multiple external contact pads and at least one electrostatic conductive pad near a window of the dielectric layer. The passivation layer, formed on the circuit layer, has several first openings to expose the external contact pads and a second opening to reveal the electrostatic conductive pad and the window of the dielectric layer. The fingerprint sensor chip is electronically connected to the substrate, with a sensing region exposed via the second opening and the window.

Career Highlights

Wei-Te Chu is currently employed at Chipbond Technology Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing the capabilities of fingerprint sensors, making them more efficient and reliable.

Collaborations

Some of his notable coworkers include Charles Yang and Yung-Jen Chen, who have collaborated with him on various projects within the company.

Conclusion

Wei-Te Chu's contributions to fingerprint sensor technology exemplify the importance of innovation in the tech industry. His patent reflects a significant advancement in the design and functionality of fingerprint sensors, showcasing his expertise and commitment to technological progress.