Chipbond Technology Corporation

Yeh-Shun Chen

Yung-Jen Chen

Charles Yang

Tun-Yu Chen

Lin-Hsin Chen

Hua-Ping Chen

Wei-Te Chu

Heng-Ting Liu

A sliding type thin fingerprint sensor package mainly comprises a substrate and a fingerprint sensor chip. The chip defined as a sliding region and a conductive portion comprises a dielectric layer, a circuit layer and a passivation layer. The circuit layer has a plurality of external contact pads and at least one electrostatic conductive pad close to a window of the dielectric layer. The passivation layer formed on the circuit layer has a plurality of first openings to expose the external contact pads and a second opening to expose the electrostatic conductive pad of the circuit layer and the window of the dielectric layer. The electrostatic conductive pad and the window are located at the sliding region and the external contact pads are located at the conductive portion. The fingerprint sensor chip is electronically connected with the substrate. A sensing region of the fingerprint sensor chip is exposed via the second opening of the passivation layer and the window of the dielectric layer.

Package, packaging method and substrate thereof for sliding type thin fingerprint sensor

A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprises a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected with the substrate and a sensing region of the fingerprint sensor chip is exposed by a window of the dielectric layer. The metal plate is electrically connected with the substrate and a sliding surface of the metal plate is close to the sensing region of the fingerprint sensor chip. The sensing region and the sliding surface are exposed by the window of the dielectric layer. The sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, and a plurality of external contact pads on a circuit layer of the substrate are located at the conductive portion.

Sliding type thin fingerprint sensor package

Growing community of inventors

Kaohsiung, Taiwan

Yeh-Shun Chen