Yee Kim Lee

Title: Innovations of Yee Kim Lee

Introduction

Yee Kim Lee is a notable inventor based in Segamat, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on developing devices that enhance the performance and reliability of semiconductor packages.

Latest Patents

Yee Kim Lee's latest patents include the "Delamination resistant device package having raised bond surface and mold locking aperture." This invention is a semiconductor package designed to achieve a thin profile and low moisture sensitivity. The package features a semiconductor die mounted on a die attachment site of a leadframe, connected with a plurality of elongate I/O leads arranged around the die attach pad. The leadframe includes an 'up-set' bonding pad that supports multiple wire bonds and has a large mold flow aperture. This design allows the mold material to flow effectively, ensuring well-supported wire bonds and low moisture sensitivity.

Another significant patent is the "Delamination resistant device package having low moisture sensitivity." This invention presents a lead frame and package construction that also aims for a thin profile and low moisture sensitivity. The lead frames include a die attach pad with a die attachment site and an elongate ground lead. The design features 'up-set' bonding pads that are electrically connected to the die attach pad, providing a bonding surface for wire bonds. The package incorporates an encapsulant that surrounds the bonding support and flows through the mold flow aperture, ensuring low moisture sensitivity.

Career Highlights

Yee Kim Lee has been instrumental in advancing semiconductor packaging technology during his tenure at National Semiconductor Corporation. His innovative designs have contributed to the development of more reliable and efficient semiconductor devices.

Collaborations

Yee Kim Lee has collaborated with several talented individuals in his field, including Peng Soon Lim and Terh Kuen Yii. Their combined expertise has fostered a productive environment for innovation and development.

Conclusion

Yee Kim Lee's contributions to semiconductor packaging through his patents demonstrate his commitment to innovation and excellence in technology. His work continues to influence the industry, paving the way for future advancements.