National Semiconductor Corporation

Yee Kim Lee

Lee Han Meng@Eugene Lee

Peng Soon Lim

Terh Kuen Yii

Felix C Li

Shaw Wei Lee

Lee Han Meng @ Eugene Lee

Ein Sun Ng

Chue Siak Liu

A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. The leadframe having an 'up-set' bonding pad arranged with a bonding support for supporting a plurality of wire bonds and a large mold flow aperture in the up-set bonding pad. The package encapsulated in a mold material that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.

Delamination resistant device package having raised bond surface and mold locking aperture

A lead frame and package construction configured to attain a thin profile and low moisture sensitivity. Lead frames of this invention may include a die attach pad having a die attachment site and an elongate ground lead that extends from the die attach pad. The lead frame includes a plurality of elongate I/O leads arranged about the die attach pad and extending away from the die attach pad in at least two directions. An inventive lead frame features 'up-set' bonding pads electrically connected with the die attach pad and arranged with a bonding surface for supporting a plurality of wire bonds. The bonding surfaces also constructed to define at least one mold flow aperture for each up-set bonding pad. A package incorporating the lead frame is further disclosed such that the package includes an encapsulant that surrounds the bonding support and flows through the mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity. Such packages can be constructed in single inline configuration, dual inline configuration, quad package configurations.

Delamination resistant device package having low moisture sensitivity

Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.

Leadframe packages having enhanced ground-bond reliability

A lead frame and package construction configured to attain a thin profile and low moisture sensitivity. Lead frames of this invention may include a die attach pad having a die attachment site and an elongate ground lead that extends from the die attach pad. The lead frame includes a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. An inventive lead frame features an 'up-set' bonding pad electrically connected with the die attach pad and arranged with a bonding support for supporting a plurality of wire bonds. The lead frame also having a large mold flow aperture in the up-set bonding pad. A package incorporating the lead frame is further disclosed such that the package includes an encapsulant that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.

Growing community of inventors

Segamat, Malaysia

Yee Kim Lee