The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
Aug. 13, 2008
Felix C. LI, Sunnyvale, CA (US);
Yee Kim Lee, Segamat, MY;
Peng Soon Lim, Melaka, MY;
Terh Kuen Yii, Kuala Lumpur, MY;
Lee Han Meng@eugene Lee, Muar, MY;
Felix C. Li, Sunnyvale, CA (US);
Yee Kim Lee, Segamat, MY;
Peng Soon Lim, Melaka, MY;
Terh Kuen Yii, Kuala Lumpur, MY;
Lee Han Meng@Eugene Lee, Muar, MY;
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A lead frame and package construction configured to attain a thin profile and low moisture sensitivity. Lead frames of this invention may include a die attach pad having a die attachment site and an elongate ground lead that extends from the die attach pad. The lead frame includes a plurality of elongate I/O leads arranged about the die attach pad and extending away from the die attach pad in at least two directions. An inventive lead frame features 'up-set' bonding pads electrically connected with the die attach pad and arranged with a bonding surface for supporting a plurality of wire bonds. The bonding surfaces also constructed to define at least one mold flow aperture for each up-set bonding pad. A package incorporating the lead frame is further disclosed such that the package includes an encapsulant that surrounds the bonding support and flows through the mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity. Such packages can be constructed in single inline configuration, dual inline configuration, quad package configurations.