Kuala Lumpur, Malaysia

Terh Kuen Yii


Average Co-Inventor Count = 4.2

ph-index = 5

Forward Citations = 89(Granted Patents)


Location History:

  • Melaka, MY (2010)
  • Kuala Lumpur, MY (2009 - 2014)

Company Filing History:


Years Active: 2009-2014

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6 patents (USPTO):

Title: Terh Kuen Yii: Innovator in Semiconductor Packaging

Introduction

Terh Kuen Yii is a prominent inventor based in Kuala Lumpur, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His innovative designs focus on enhancing the performance and reliability of semiconductor devices.

Latest Patents

One of his latest patents is the "Delamination resistant device package having raised bond surface and mold locking aperture." This invention features a semiconductor package designed to achieve a thin profile and low moisture sensitivity. The package includes a semiconductor die mounted on a die attachment site of a leadframe, connected with a plurality of elongate I/O leads arranged around the die attach pad. The leadframe is equipped with an 'up-set' bonding pad that supports multiple wire bonds and a large mold flow aperture, ensuring well-supported wire bonds and low moisture sensitivity.

Another notable patent is the "Delamination resistant device package having low moisture sensitivity." This invention presents a lead frame and package construction that also aims for a thin profile and low moisture sensitivity. The lead frames include a die attach pad with a die attachment site and an elongate ground lead extending from it. The design features 'up-set' bonding pads that are electrically connected to the die attach pad, providing a bonding surface for wire bonds. The encapsulant flows through the mold flow aperture, ensuring well-supported wire bonds and low moisture sensitivity.

Career Highlights

Terh Kuen Yii is currently employed at National Semiconductor Corporation, where he continues to innovate in semiconductor technology. His work has significantly impacted the industry, particularly in developing packaging solutions that enhance device performance.

Collaborations

He has collaborated with notable coworkers, including Peng Soon Lim and Yee Kim Lee, contributing to various projects that advance semiconductor packaging technology.

Conclusion

Terh Kuen Yii is a distinguished inventor whose work in semiconductor packaging has led to several innovative patents. His contributions continue to shape the future of the semiconductor industry, ensuring devices are more reliable and efficient.

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