The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2010

Filed:

Jul. 23, 2007
Applicants:

Peng Soon Lim, Melaka, MY;

Terh Kuen Yii, Melaka, MY;

Mohd Sabri Bin Mohamad Zin, Melaka, MY;

Ken Pham, San Jose, CA (US);

Inventors:

Peng Soon Lim, Melaka, MY;

Terh Kuen Yii, Melaka, MY;

Mohd Sabri Bin Mohamad Zin, Melaka, MY;

Ken Pham, San Jose, CA (US);

Assignee:

National Semiconductor Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

An improved leadframe panel suitable for use in packaging IC dice is described. The described leadframe panel is configured such that the amount of leadframe material that is removed during singulation of the leadframe panel is reduced.


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