The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Dec. 13, 2011
Felix C. LI, Sunnyvale, CA (US);
Yee Kim Lee, Segamat, MY;
Peng Soon Lim, Melaka, MY;
Terh Kuen Yii, Kuala Lumpur, MY;
Lee Han Meng@eugene Lee, Muar, MY;
Felix C. Li, Sunnyvale, CA (US);
Yee Kim Lee, Segamat, MY;
Peng Soon Lim, Melaka, MY;
Terh Kuen Yii, Kuala Lumpur, MY;
Lee Han Meng@Eugene Lee, Muar, MY;
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. The leadframe having an 'up-set' bonding pad arranged with a bonding support for supporting a plurality of wire bonds and a large mold flow aperture in the up-set bonding pad. The package encapsulated in a mold material that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.