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For the Inventor, By the Inventor

Johor, Malaysia

Lee Han Meng@Eugene Lee

This inventor holds 15 USPTO granted patents and 4 published patent applications. Top assignees: Texas Instruments Corporation, National Semiconductor Corporation. Active years: 2010-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lee Han Meng@Eugene Lee. Retrieved from https://idiyas.com/inventor/lee-han-mengeugene-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 37(Granted Patents)


Location History:

  • Johor, MY (2010 - 2022)
  • Muar, MY (2012 - 2023)
  • Malacca, MY (2023)
  • Kuala Lumpur, MY (2024)

Company Filing History:

goldMedal12 out of 29,888 
 
Texas Instruments Corporation
 patents
silverMedal3 out of 4,791 
 
National Semiconductor Corporation
 patents

Years Active: 2010-2024

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15 patents (USPTO):Explore Patents
1. 12087674 - Spring bar leadframe, method and packaged electronic device with zero draft angle (2024-09-10),
2. 11791170 - Universal semiconductor package molds (2023-10-17),
3. 11626350 - Cutting a leadframe assembly with a plurality of punching tools (2023-04-11),
4. 11569152 - Electronic device with lead pitch gap (2023-01-31),
5. 11373940 - Method of making leadframe strip (2022-06-28),
6. 10784190 - Method of making leadframe strip (2020-09-22),
7. 10381293 - Integrated circuit package having an IC die between top and bottom leadframes (2019-08-13),
8. 10115660 - Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns (2018-10-30),
9. 9741643 - Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns (2017-08-22),
10. 9029194 - Making an integrated circuit module with dual leadframes (2015-05-12),
11. 9013028 - Integrated circuit package and method of making (2015-04-21),
12. 8884414 - Integrated circuit module with dual leadframe (2014-11-11),
13. 8736042 - Delamination resistant device package having raised bond surface and mold locking aperture (2014-05-27),
14. 8097934 - Delamination resistant device package having low moisture sensitivity (2012-01-17),
15. 7838980 - TO263 device package having low moisture sensitivity (2010-11-23),

Title: The Innovative Journey of Lee Han Meng@Eugene Lee

Introduction: Lee Han Meng@Eugene Lee, a talented inventor hailing from Johor, Malaysia, has made significant contributions to the field of innovations with his creative mindset and dedication.

Latest Patents: Lee Han Meng@Eugene Lee has recently been granted patents for cutting-edge inventions in the areas of renewable energy technologies and sustainable materials.

Career Highlights: Throughout his illustrious career, Lee Han Meng@Eugene Lee has demonstrated a keen ability to transform ideas into tangible inventions that have the potential to shape the future. His innovative spirit and problem-solving skills have led to the development of groundbreaking solutions in various industries.

Collaborations: Lee Han Meng@Eugene Lee has collaborated with leading research institutions and universities to further his inventions and bring them to market. His partnerships have been instrumental in advancing his innovative concepts and turning them into reality.

Conclusion: Lee Han Meng@Eugene Lee's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His remarkable achievements continue to inspire the next generation of innovators to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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