The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2015
Filed:
Jan. 04, 2013
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 2224/83192 (2013.01); H01L 24/97 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49433 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/85439 (2013.01); H01L 2924/00014 (2013.01); H01L 24/83 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83862 (2013.01); H01L 23/3107 (2013.01); H01L 21/561 (2013.01); H01L 2224/97 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 21/4842 (2013.01);
Abstract
An integrated circuit ('IC') device and method of making it. The IC device may include a conductive lead frame that has a die pad with a relatively larger central body portion and at least one relatively smaller peripheral portion in electrical continuity with the central body portion. The peripheral portion(s) project laterally outwardly from the central body portion of the die pad. Lateral displacement of a portion(s) of an encapsulation layer overlying the peripheral portion(s) is resisted by abutting surfaces on the peripheral portion(s) and the encapsulation layer.